There is a global need for electronics that are safe, reliable, and trustworthy, especially for harsh environments under wide range of temperature, humidity, and radiation conditions. The design, manufacturing, testing, and use of these microchips is challenged by a number of factors, including disruptions of the manufacturing chain as well as an urgent need for a rapid increase in the skilled electronics workforce, as well as parts evaluation engineers. The proposed partnership between UCF CECS and the NASA Electronics Parts and Packaging (NEPP) program will address this need, and UCF will be the first partner university for Space and defense electronics applications, meeting the needs of our graduates and of our industrial partners.
The NEPP is promoting the development of a NASA Parts Engineering Program alongside university partners through NASA center-wide collaborations between NASA Jet Propulsion Laboratory (JPL), Goddard Space Flight Center (GSFC), Marshall Space Flight Center (MSFC), Langley Research Center (LaRC), and Kennedy Space Center (KSC). The program aims to address the knowledge gap in the current electronic parts engineering workforce and will lead to increases in the number of trained professionals in the workforce, including the cultivation of the next generation of Parts Engineers.
Students in this program will gain foundational knowledge in engineering assessment, reliability-related performance for all Electrical Electronic Electromechanical (EEE) parts. Their training will equip them to support projects through informed part selection that maximizes reliability across the project life cycle while balancing schedule and cost constraints. They will develop strong competencies in overseeing part procurement and collaborating with parts manufacturers to ensure compliance with engineering requirements.
Additionally, students will learn how to establish comprehensive testing plans for EEE parts, including screening and qualification test campaigns and any screening and qualification campaigns, failure analysis, and the evaluation of test results to determine suitability for space flight usage. Students will also be able to assess the capabilities of emerging EEE technologies and suppliers for spaceflight use. These skills will benefit not only NASA, but also the rapidly expending commercial space sector and other critical infrastructure sectors that rely on microelectronic devices and integrated circuits operating in harsh environments.
Please note: Electronic Parts Engineering Graduate Certificate may be completed fully online, although not all elective options or program prerequisites may be offered online. Newly admitted students choosing to complete this program exclusively via UCF online classes may enroll with a reduction in campus-based fees.
International students (F or J visa) are required to enroll in a full-time course load of 9 credit hours during the fall and spring semesters. Only 3 of the 9 credit hours may be taken in a completely online format. For a detailed listing of enrollment requirements for international students, please visit UCF Global. If you have questions, please consult UCF Global at 407-823-2337. UCF is not authorized to provide online courses or instruction to students in some states. Refer to State Restrictions for current information.
Program Prerequisites
Bachelor’s degrees in science technology engineering and mathematics (STEM) disciplines.
Degree Requirements
12 - 14 Total Credits
- Complete all of the following
- Complete at least 2 of the following:
- EEE5352 - Semiconductor Material and Device Characterization (3)
- ESI5236 - Reliability Engineering (3)
- EEL5245 - Power Electronics (3)
- EEE5416 - Radiation Effects and Reliability in Microelectronics (3)
- EEL 5937 - ST: Introduction to Space Electronics (3)
- Complete at least 2 of the following:
- EEE5323 - Radio Frequency Integrated Circuit Design (3)
- EEE5353 - Semiconductor Device Modeling and Simulation (3)
- EEL5659 - Introduction to Sensors (3)
- EEL5439C - RF and Microwave Active Circuits (4)
- EEL5722C - Field-Programmable Gate Array (FPGA) Design (3)
- EMA5415 - Electronic Principles of Materials Properties (3)
- EEE5356C - Fabrication of Solid-State Devices (4)
- ESI5219 - Engineering Statistics (3)
- EEE6326C - MEMS Fabrication Laboratory (3)
- EEE6317 - Power Semiconductor Devices and Integrated Circuits (3)
- EEE5332C - Thin Film Technology (3)
- EML6233 - Fundamentals of Fatigue Analysis (3)
- EEE6338 - Advanced Topics in Microelectronics (3)
Grand Total Credits: 12 - 14
Financial Information
Graduate students may receive financial assistance through fellowships, assistantships, tuition support, or loans. For more information, see the College of Graduate Studies Funding website, which describes the types of financial assistance available at UCF and provides general guidance in planning your graduate finances. The Financial Information section of the Graduate Catalog is another key resource.
Fellowship Information
Fellowships are awarded based on academic merit to highly qualified students. They are paid to students through the Office of Student Financial Assistance, based on instructions provided by the College of Graduate Studies. Fellowships are given to support a student's graduate study and do not have a work obligation. For more information, see UCF Graduate Fellowships, which includes descriptions of university fellowships and what you should do to be considered for a fellowship.
- Opportunities for internships in NASA, DOD labs and industrial partners.
- Potential scholarships and awards.
